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1. 
Cover image for Hyper Bio Assembler for 3D Cellular Systems
Hyper Bio Assembler for 3D Cellular Systems
Author 
Arai, Tatsuo. editor. Arai, Fumihito. editor. Yamato, Masayuki. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-4-431-55297-0
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2. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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3. 
Cover image for Optical nano and micro actuator technology
Optical nano and micro actuator technology
Author 
Knopf, George K. Otani, Yukitoshi.
Preferred Shelf Number 
TK8304 .O65 2013
Electronic Access 
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