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Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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2. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
Author 
Wang, Kaiying. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-95-1606-3
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3. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
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4. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
Electronic Access 
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