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1. 
Cover image for Mechanics of microsystems
Mechanics of microsystems
Author 
Corigliano, Alberto, author.
Preferred Shelf Number 
TK7875
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119053828
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2. 
Cover image for The Investigation of Plastic Behavior by Discrete Dislocation Dynamics for Single Crystal Pillar at Submicron Scale
The Investigation of Plastic Behavior by Discrete Dislocation Dynamics for Single Crystal Pillar at Submicron Scale
Author 
Cui, Yinan. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-3032-1
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3. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
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4. 
Cover image for Springer Handbook of Nanotechnology
Springer Handbook of Nanotechnology
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-54357-3
Format: 
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5. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50824-5
Format: 
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6. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
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7. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2128-7
Format: 
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8. 
Cover image for MEMS and Microstructures in aerospace applications
MEMS and Microstructures in aerospace applications
Author 
Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.
Preferred Shelf Number 
TL589 .O85 2006
Electronic Access 
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