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1. 
Cover image for Semiconductor packaging materials interaction and reliability
Semiconductor packaging materials interaction and reliability
Author 
Chen, Andrea. Lo, Randy.
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ONLINE
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2. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
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ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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3. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
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