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Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07611-9
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2. 
Cover image for Design of cost-efficient interconnect processing units : Spidergon STNoC
Design of cost-efficient interconnect processing units : Spidergon STNoC
Author 
Coppola, Marcello.
Preferred Shelf Number 
TK5105.546 .D47 2009
Electronic Access 
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