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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for Micro and Nano Fabrication Tools and Processes
Micro and Nano Fabrication Tools and Processes
Author 
Gatzen, Hans H. author. Saile, Volker. author. Leuthold, Jürg. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-44395-8
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3. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
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Online Library~1
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