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1. 
Cover image for Microengineering of metals and ceramics
Microengineering of metals and ceramics
Author 
Löhe, Detlef. Hausselt, Jürgen. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
An electronic book accessible through the World Wide Web; click for information
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0627/2005283916-b.html
John Wiley http://dx.doi.org/10.1002/9783527616725
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2. 
Cover image for Microengineering of metals and ceramics
Microengineering of metals and ceramics
Author 
Löhe, Detlef. Hausselt, Jürgen.
Preferred Shelf Number 
QC176.8.M5 M53 2005 V.4/PT.2
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Beytepe Library~2
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3. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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4. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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5. 
Cover image for Aluminum Matrix Composites Reinforced with Alumina Nanoparticles
Aluminum Matrix Composites Reinforced with Alumina Nanoparticles
Author 
Casati, Riccardo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-27732-5
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