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Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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2. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
Author 
Wang, Kaiying. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-95-1606-3
Format: 
Availability 
Online Library~1
Available:
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