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1. 
Cover image for Microelectronics to nanoelectronics : materials, devices & manufacturability
Microelectronics to nanoelectronics : materials, devices & manufacturability
Author 
Kaul, Anupama B.
Preferred Shelf Number 
T174.7 .M498 2013
Electronic Access 
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2. 
Cover image for Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Author 
Paik, Ungyu. Park, Jea-Gun.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429291890
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Advances in chemical mechanical planarization (CMP)
Advances in chemical mechanical planarization (CMP)
Author 
Babu, S. V., editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780081001653
Format: 
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