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1. 
Cover image for Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Author 
Aly, Mohamed M. Sabry. editor. Chattopadhyay, Anupam. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-16-7487-7
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2. 
Cover image for Electrodeposition and Surface Finishing Fundamentals and Applications
Electrodeposition and Surface Finishing Fundamentals and Applications
Author 
Djokić, Stojan S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-0289-7
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3. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08726-9
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4. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-1-4614-9176-7
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5. 
Cover image for Transport Properties of Molecular Junctions
Transport Properties of Molecular Junctions
Author 
Zimbovskaya, Natalya A. author. SpringerLink (Online service)
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ONLINE(332381.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-8011-2
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