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1. 
Cover image for Emerging nanotechnologies for manufacturing
Emerging nanotechnologies for manufacturing
Author 
Ahmed, Waqar. Jackson, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515838
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2. 
Cover image for Additive Manufacturing of Emerging Materials
Additive Manufacturing of Emerging Materials
Author 
AlMangour, Bandar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-91713-9
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3. 
Cover image for Design and Manufacturing of Active Microsystems
Design and Manufacturing of Active Microsystems
Author 
Büttgenbach, Stephanus. editor. Burisch, Arne. editor. Hesselbach, Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-12903-2
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4. 
Cover image for Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Author 
Yin, Zhouping. author. Huang, Yongan. author. Duan, Yongqing. author. Zhang, Haitao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4759-6
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5. 
Cover image for Virtual Prototyping & Bio Manufacturing in Medical Applications
Virtual Prototyping & Bio Manufacturing in Medical Applications
Author 
Bidanda, Bopaya. editor. Bártolo, Paulo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68831-2
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6. 
Cover image for A Practical Guide to Design for Additive Manufacturing
A Practical Guide to Design for Additive Manufacturing
Author 
Diegel, Olaf. author. Nordin, Axel. author. Motte, Damien. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-8281-9
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7. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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8. 
Cover image for Proceedings of International Conference on Intelligent Manufacturing and Automation ICIMA 2018
Proceedings of International Conference on Intelligent Manufacturing and Automation ICIMA 2018
Author 
Vasudevan, Hari. editor. Kottur, Vijaya Kumar N. editor. Raina, Amool A. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-2490-1
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9. 
Cover image for Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Author 
Mahamood, Rasheedat Modupe. author. Akinlabi, Esther Titilayo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-75118-4
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10. 
Cover image for Nano-optoelectronic sensors and devices nanophotonics from design to manufacturing
Nano-optoelectronic sensors and devices nanophotonics from design to manufacturing
Author 
Xi, Ning. Lai, King Wai Chiu.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437734713
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11. 
Cover image for Safety of Nanoparticles From Manufacturing to Medical Applications
Safety of Nanoparticles From Manufacturing to Medical Applications
Author 
Webster, Thomas J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78608-7
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12. 
Cover image for Metrology
Metrology
Author 
Gao, Wei. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4938-5
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