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1. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5719-1
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2. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-85695-7
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3. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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4. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-48433-4
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5. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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6. 
Cover image for Active Metamaterials Terahertz Modulators and Detectors
Active Metamaterials Terahertz Modulators and Detectors
Author 
Rout, Saroj. author. Sonkusale, Sameer. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-52219-7
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7. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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8. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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9. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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10. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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11. 
Cover image for High-Efficiency Solar Cells Physics, Materials, and Devices
High-Efficiency Solar Cells Physics, Materials, and Devices
Author 
Wang, Xiaodong. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-01988-8
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12. 
Cover image for Applications of Graphene An Overview
Applications of Graphene An Overview
Author 
Wolf, E. L. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-03946-6
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