Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
9 Results Found Subscribe to search results
000000000DEFAULT
Print
1. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
Format: 
Availability 
Online Library~1
Available:
Copies: