Title:
Materials for Information Technology Devices, Interconnects and Packaging
Author:
Zschech, Ehrenfried. editor.
ISBN:
9781846282355
Physical Description:
XIX, 508 p. 338 illus. online resource.
Series:
Engineering Materials and Processes,
Series Title:
Engineering Materials and Processes, 1619-0181
Added Corporate Author:
Electronic Access:
http://dx.doi.org/10.1007/1-84628-235-7Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 175333-2001 | ONLINE | Searching... | Searching... |