Advanced Materials for Thermal Management of Electronic Packaging

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Title:

Author:

Tong, Xingcun Colin. author.

ISBN:

9781441977595

Physical Description:

XXII, 618 p. online resource.

Series:

Springer Series in Advanced Microelectronics, 30

Series Title:

Springer Series in Advanced Microelectronics, 1437-0387 ; 30

Subject Term:

Added Corporate Author:

Electronic Access:

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Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	172970-2001	ONLINE	Searching... Unknown	Searching... Unavailable