Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Title:
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author:
Iyer, S. S., ed.
ISBN:
9781849193702
Publication Information:
Stevenage : IET, 2002.
Physical Description:
1 online resource (175 p.)
Series:
Circuits, Devices and Systems
Series Title:
Circuits, Devices and Systems
Subject Term:
Bonding.

Electric resistance.

Grinding and polishing.

Integrated circuits--Very large scale integration.

Micromechanics.

Semiconductor wafers.

Silicon.

Silicon-on-insulator technology.
Added Author:
Iyer, S. S.,

Auberton-Herv�, A. J.,
Electronic Access:
http://dx.doi.org/10.1049/PBEP001E
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