Through-silicon vias for 3D integration

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Title:

Author:

Lau, John.

ISBN:

9780071785150

Publication Information:

New York : McGraw Hill Professional, [2012]

Physical Description:

1 electronic text (xxiv, 487 p. : ill. (some col.)) : PDF file.

Series:

McGraw Hill ebook library. Engineering and computing, Electrical and electronics

Series Title:

McGraw Hill ebook library. Engineering and computing, Electrical and electronics

Subject Term:

Electronic Access:

Holds:
Copies:

Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	293478-1001	ONLINE	Searching... Unknown	Searching... Unavailable