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1. 
Cover image for Innovations and Dynamics in Photonics and Electronics
Innovations and Dynamics in Photonics and Electronics
Author 
Katti, Vijaya. editor. Pande, Milind. editor. Jadhav, Pravin. editor. Katti, Aavishkar. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-96-3065-3
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2. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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3. 
Cover image for Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Author 
Ciofi, Carmine. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-48711-8
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4. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-3-031-21610-7
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