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1. 
Cover image for Product maturity. 2, Principles and illustrations
Product maturity. 2, Principles and illustrations
Author 
Bayle, Franck, author.
Preferred Shelf Number 
TA169
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119988342
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2. 
Cover image for Technische Informatik Band 2: Entwurf digitaler Schaltungen
Technische Informatik Band 2: Entwurf digitaler Schaltungen
Author 
Kemnitz, Günter. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-17447-6
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3. 
Cover image for Leistungselektronik Ein Handbuch Band 1 / Band 2
Leistungselektronik Ein Handbuch Band 1 / Band 2
Author 
Zach, Franz. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-89214-5
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4. 
Cover image for Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Author 
Yazdani, Farhang. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-75769-8
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5. 
Cover image for VLSI Design: Circuits, Systems and Applications Select Proceedings of ICNETS2, Volume V
VLSI Design: Circuits, Systems and Applications Select Proceedings of ICNETS2, Volume V
Author 
Li, Jie. editor. Sankar, A Ravi. editor. Beulet, P Augusta Sophy. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-7251-2
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6. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-58175-0
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7. 
Cover image for Intelligent Embedded Systems Select Proceedings of ICNETS2, Volume II
Intelligent Embedded Systems Select Proceedings of ICNETS2, Volume II
Author 
Thalmann, Daniel. editor. Subhashini, N. editor. Mohanaprasad, K. editor. Murugan, M S Bala. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-10-8575-8
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8. 
Cover image for Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications ICMEET 2016
Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications ICMEET 2016
Author 
Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Chowdary, P. Satish Rama. editor. Chakravarthy, V.V.S.S. Sameer. editor. Anguera, Jaume. editor.
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https://doi.org/10.1007/978-981-10-4280-5
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9. 
Cover image for 3-Dimensional VLSI A 2.5-Dimensional Integration Scheme
3-Dimensional VLSI A 2.5-Dimensional Integration Scheme
Author 
Deng, Yangdong. author. Maly, Wojciech P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-04157-0
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10. 
Cover image for Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits 2nd Edition
Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits 2nd Edition
Author 
Sachdev, Manoj. editor. Gyvez, José Pineda de. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/0-387-46547-2
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11. 
Cover image for Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Author 
Kiameh, Philip.
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12. 
Cover image for Architecting resilient systems
Architecting resilient systems
Author 
Jackson, Scott, author.
Preferred Shelf Number 
TA169
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394258239
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