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1. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331105.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4944-6
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2. 
Cover image for Factors Governing Tin Whisker Growth
Factors Governing Tin Whisker Growth
Author 
Crandall, Erika R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332756.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00470-9
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3. 
Cover image for Lead-Free Piezoelectrics
Lead-Free Piezoelectrics
Author 
Priya, Shashank. editor. Nahm, Sahn. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9598-8
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4. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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5. 
Cover image for Sensors and Microsystems AISEM 2010 Proceedings
Sensors and Microsystems AISEM 2010 Proceedings
Author 
Neri, Giovanni. editor. Donato, Nicola. editor. d'Amico, Arnaldo. editor. Di Natale, Corrado. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-1324-6
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6. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47318-5
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7. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88783-8
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8. 
Cover image for Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Author 
El-Kareh, Badih. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69010-0
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