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1. 
Cover image for Handbook of human systems integration
Handbook of human systems integration
Author 
Booher, Harold R.
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ONLINE
Electronic Access 
Knovel http://app.knovel.com/web/toc.v/cid:kpHHSI0003
John Wiley http://dx.doi.org/10.1002/0471721174
http://www3.interscience.wiley.com/cgi-bin/bookhome/109868385
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley043/2002044604.html
HathiTrust Digital Library, Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/51242071.html
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2. 
Cover image for Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Author 
Yazdani, Farhang. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-75769-8
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3. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
Author 
Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6460-1
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4. 
Cover image for Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design
Author 
Papanikolaou, Antonis. editor. Soudris, Dimitrios. editor. Radojcic, Riko. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0962-6
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5. 
Cover image for 3D Integration for NoC-based SoC Architectures
3D Integration for NoC-based SoC Architectures
Author 
Sheibanyrad, Abbas. editor. Pétrot, Frédéric. editor. Jantsch, Axel. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7618-5
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6. 
Cover image for 3-Dimensional VLSI A 2.5-Dimensional Integration Scheme
3-Dimensional VLSI A 2.5-Dimensional Integration Scheme
Author 
Deng, Yangdong. author. Maly, Wojciech P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-04157-0
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7. 
Cover image for The economics of human systems integration valuation of investments in people's training and education, safety and health, and work productivity
The economics of human systems integration valuation of investments in people's training and education, safety and health, and work productivity
Author 
Rouse, William B.
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ONLINE
Electronic Access 
Access restricted to McGill users
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John Wiley http://dx.doi.org/10.1002/9780470642627
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8. 
Cover image for Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Author 
El-Kareh, Badih. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69010-0
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9. 
Cover image for Low-Power High-Speed ADCs for Nanometer CMOS Integration
Low-Power High-Speed ADCs for Nanometer CMOS Integration
Author 
Cao, Zhiheng. author. Yan, Shouli. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-8450-8
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10. 
Cover image for Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Author 
Wieferink, Andreas. author. Meyr, Heinrich. author. Leupers, Rainer. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4020-8652-6
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11. 
Cover image for Vlsi-Soc: From Systems To Silicon Proceedings of IFIP TC 10, WG 10.5, Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC 2005), October 17-19, 2005, Perth, Australia
Vlsi-Soc: From Systems To Silicon Proceedings of IFIP TC 10, WG 10.5, Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC 2005), October 17-19, 2005, Perth, Australia
Author 
Reis, Ricardo. editor. Osseiran, Adam. editor. Pfleiderer, Hans-Joerg. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-73661-7
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12. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-28843-0
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