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Cover image for ADVANCED SOFT ELECTRONICS IN BIOMEDICAL ENGINEERING materials, manufactures, and applications
ADVANCED SOFT ELECTRONICS IN BIOMEDICAL ENGINEERING materials, manufactures, and applications
Author 
Chen, Mengxiao, 1989- editor.
Preferred Shelf Number 
R857 .M3
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003493631
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Advances in microwave engineering : from novel materials to novel microwave applications
Advances in microwave engineering : from novel materials to novel microwave applications
Author 
Bhattacharya, Ankan, editor. Roy, Bappadittya, editor. De, Arnab, editor. Chakraborty, Ujjal (Professor of electronics and communication engineering), editor. Bhattacharjee, Anup Kumar, editor.
Preferred Shelf Number 
TK7876
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003459880
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Nano-interconnect materials and models for next generation integrated circuit design
Nano-interconnect materials and models for next generation integrated circuit design
Author 
Bhattacharya, Sandip (Professor of electrical engineering), editor. J., Ajayan, editor. Herrera, Fernando Avila, editor.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003331650
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
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