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1. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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2. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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3. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
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4. 
Cover image for Enabling the Internet of Things From Integrated Circuits to Integrated Systems
Enabling the Internet of Things From Integrated Circuits to Integrated Systems
Author 
Alioto, Massimo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51482-6
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