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1. 
Cover image for Quality and Reliability of Large-Eddy Simulations
Quality and Reliability of Large-Eddy Simulations
Author 
Meyers, Johan. editor. Geurts, Bernard J. editor. Sagaut, Pierre. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8578-9
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2. 
Cover image for Recent Advances in Mechanical Engineering Select Proceedings of CAMSE 2021
Recent Advances in Mechanical Engineering Select Proceedings of CAMSE 2021
Author 
Manik, Gaurav. editor. Kalia, Susheel. editor. Verma, Om Prakash. editor. Sharma, Tarun K. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2188-9
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3. 
Cover image for Direct and Large-Eddy Simulation IX
Direct and Large-Eddy Simulation IX
Author 
Fröhlich, Jochen. editor. Kuerten, Hans. editor. Geurts, Bernard J. editor. Armenio, Vincenzo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14448-1
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4. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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