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Cover image for Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Author 
Tighe, Rachael C. editor. Considine, John. editor. Kramer, Sharlotte L.B. editor. Berfield, Tom. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-17475-9
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2. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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3. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
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Jha, Chandra Mohan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2581-0
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Cover image for Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
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Kiameh, Philip.
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5. 
Cover image for Fluid Flow, Heat Transfer and Boiling in Micro-Channels
Fluid Flow, Heat Transfer and Boiling in Micro-Channels
Author 
Yarin, L.P. author. Mosyak, A. author. Hetsroni, G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-78755-6
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