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1. 
Cover image for Integrated power devices and TCAD simulation
Integrated power devices and TCAD simulation
Author 
Fu, Yue (Electrical engineer), author. Li, Zhanming, author. Ng, Wai Tung, author. Sin, Johnny K. O., author.
Preferred Shelf Number 
TK7871.85 .F794 2014
Electronic Access 
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2. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
Preferred Shelf Number 
ONLINE
Electronic Access 
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3. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
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John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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