Title:
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author:
Seok, Seonho. author.
ISBN:
9783319778723
Edition:
1st ed. 2018.
Physical Description:
VIII, 115 p. 106 illus. online resource.
Series:
Springer Series in Advanced Manufacturing,
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-3-319-77872-3Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 400941-1001 | ONLINE | Searching... | Searching... |