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1. 
Cover image for Güç kontrol devreleri : uygulamalı elektronik devreler - 5
Güç kontrol devreleri : uygulamalı elektronik devreler - 5
Author 
Gerçek, Cihan, derl. Bodur, Aydın, derl. Dinçer, Gökhan, derl.
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TK 7867 G921 2001
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2. 
Cover image for Elektronik devre elemanları
Elektronik devre elemanları
Author 
Delebe, Erdal.
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TJ7867 D45 2024
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3. 
Cover image for High Performance and Power Efficient Electrocardiogram Detectors
High Performance and Power Efficient Electrocardiogram Detectors
Author 
Kumar, Ashish. author. Kumar, Manjeet. author. Komaragiri, Rama S. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-5303-3
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Cover image for Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Author 
Gimenez, Salvador Pinillos. author. Galembeck, Egon Henrique Salerno. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-29086-2
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5. 
Cover image for Photonic Crystal and Its Applications for Next Generation Systems
Photonic Crystal and Its Applications for Next Generation Systems
Author 
Dhanabalan, Shanmuga Sundar. editor. Thirumurugan, Arun. editor. Raju, Ramesh. editor. Kamaraj, Sathish-Kumar. editor. Thirumaran, Sridarshini. editor.
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https://doi.org/10.1007/978-981-99-2548-3
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6. 
Cover image for HEMT Technology and Applications
HEMT Technology and Applications
Author 
Lenka, Trupti Ranjan. editor. Nguyen, Hieu Pham Trung. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-2165-0
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7. 
Cover image for Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Author 
Darji, Anand D. editor. Joshi, Deepak. editor. Joshi, Amit. editor. Sheriff, Ray. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-6780-1
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8. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-030-93627-3
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9. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-30152-0
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10. 
Cover image for Antenna Technology for Terahertz Wireless Communication
Antenna Technology for Terahertz Wireless Communication
Author 
Nissanov, Uri. author. Singh, Ghanshyam. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-35900-2
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11. 
Cover image for 5G and Beyond
5G and Beyond
Author 
Bhushan, Bharat. editor. Sharma, Sudhir Kumar. editor. Kumar, Raghvendra. editor. Priyadarshini, Ishaani. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-3668-7
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12. 
Cover image for Fundamentals of Modern Electric Circuit Analysis and Filter Synthesis A Transfer Function Approach
Fundamentals of Modern Electric Circuit Analysis and Filter Synthesis A Transfer Function Approach
Author 
Izadian, Afshin. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-21908-5
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