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1. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22324-2
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2. 
Cover image for Introduction to Mixed-Signal, Embedded Design
Introduction to Mixed-Signal, Embedded Design
Author 
Doboli, Alex. author. Currie, Edward H. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7446-4
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3. 
Cover image for Real-time Iterative Learning Control Design and Applications
Real-time Iterative Learning Control Design and Applications
Author 
Xu, Jian-Xin. author. Panda, Sanjib K. author. Lee, Tong Heng. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-175-0
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4. 
Cover image for Precision Manufacturing
Precision Manufacturing
Author 
Dornfeld, David. author. Lee, Dae-Eun. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68208-2
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5. 
Cover image for Assistive Technology for Visually Impaired and Blind People
Assistive Technology for Visually Impaired and Blind People
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Hersh, Marion A. editor. Johnson, Michael A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-867-8
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6. 
Cover image for Adaptive Structural Systems with Piezoelectric Transducer Circuitry
Adaptive Structural Systems with Piezoelectric Transducer Circuitry
Author 
Tang, Jiong. author. Wang, Kon-Well. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78751-0
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7. 
Cover image for Micromanufacturing International Research and Development
Micromanufacturing International Research and Development
Author 
Ehmann, Kornel F. author. Bourell, David. author. Culpepper, Martin L. author. Hodgson, Thom J. author. Kurfess, Thomas R. author.
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http://dx.doi.org/10.1007/978-1-4020-5949-0
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8. 
Cover image for Analog Design Centering and Sizing
Analog Design Centering and Sizing
Author 
Graeb, Helmut E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6004-5
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9. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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10. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-33913-2
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11. 
Cover image for Compiling Esterel
Compiling Esterel
Author 
Potop-Butucaru, Dumitru. author. Edwards, Stephen A. author. Berry, Gérard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-70628-3
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12. 
Cover image for Optimal Production Planning for PCB Assembly
Optimal Production Planning for PCB Assembly
Author 
Ho, William. author. Ji, Ping. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-500-4
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