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Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
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2. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
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