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1. 
Cover image for Conformational analysis of polymers : methods and techniques for structure-property relationships and molecular design
Conformational analysis of polymers : methods and techniques for structure-property relationships and molecular design
Author 
Sasanuma, Yuji, author.
Preferred Shelf Number 
QD381 .S287 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119716655
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2. 
Cover image for A historical approach to materials under irradiation
A historical approach to materials under irradiation
Author 
Bouffard, Serge, author.
Preferred Shelf Number 
TA418.6
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394361861
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3. 
Cover image for Applied circular economy engineering : technologies and business solutions to implement circularity
Applied circular economy engineering : technologies and business solutions to implement circularity
Preferred Shelf Number 
HC79 .E5 A67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527847358
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4. 
Cover image for Organic polymers in energy-environmental applications
Organic polymers in energy-environmental applications
Author 
Oraon, Ramesh, editor.
Preferred Shelf Number 
TP248.65 .P62 O74 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527842810
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5. 
Cover image for Natural polymers for biomedical applications
Natural polymers for biomedical applications
Author 
Cui, Wenguo, authors. Xiang, Lei, authors.
Preferred Shelf Number 
RM666 .P797 C85 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845583
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6. 
Cover image for Thermoforming : processing and technology
Thermoforming : processing and technology
Author 
Muralisrinivasan, Natamai Subramanian, author.
Preferred Shelf Number 
TP1150 .M87 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119555889
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7. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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8. 
Cover image for Thermoplastic polymer composites : processing, properties, performance, applications and recyclability
Thermoplastic polymer composites : processing, properties, performance, applications and recyclability
Author 
Xavier, Sodagudi Francis, author.
Preferred Shelf Number 
TP1180 .P67 X38 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119865544
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9. 
Cover image for Spectroscopy and computation of hydrogen-bonded systems
Spectroscopy and computation of hydrogen-bonded systems
Author 
Wójcik, Marek J., editor. Ozaki, Y. (Yukihiro), editor.
Preferred Shelf Number 
QP517 .H93
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527834914
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10. 
Cover image for Biobased adhesives : sources, characteristics, and applications
Biobased adhesives : sources, characteristics, and applications
Author 
Dunky, Manfred, editor. Mittal, K. L., editor.
Preferred Shelf Number 
TP968 .B56 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394175406
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11. 
Cover image for Polymer crystallization : methods, characterization, and applications
Polymer crystallization : methods, characterization, and applications
Author 
Parameswaranpillai, Jyotishkumar, editor.
Preferred Shelf Number 
TP1092 .P65 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527839247
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12. 
Cover image for Defects in organic semiconductors and devices
Defects in organic semiconductors and devices
Author 
Nguyen, Thien-Phap, author.
Preferred Shelf Number 
TK7871.99 .O74 N48 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394229451
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