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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
Author 
Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-27392-1
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3. 
Cover image for Integration of Functional Oxides with Semiconductors
Integration of Functional Oxides with Semiconductors
Author 
Demkov, Alexander A. author. Posadas, Agham B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9320-4
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4. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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5. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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6. 
Cover image for Silicon Components and Processes Self Study Unit Processes and Process Integration
Silicon Components and Processes Self Study Unit Processes and Process Integration
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59219-5
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7. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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8. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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9. 
Cover image for Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Author 
Yazdani, Farhang. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-75769-8
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10. 
Cover image for Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Author 
Papa, Umberto. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-73174-2
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11. 
Cover image for Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Author 
El-Kareh, Badih. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69010-0
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12. 
Cover image for Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Author 
Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-89859-7
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