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1. 
Cover image for Wireless Power Transfer for Medical Microsystems
Wireless Power Transfer for Medical Microsystems
Author 
Sun, Tianjia. author. Xie, Xiang. author. Wang, Zhihua. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332329.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-7702-0
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2. 
Cover image for Inside Solid State Drives (SSDs)
Inside Solid State Drives (SSDs)
Author 
Micheloni, Rino. author. Marelli, Alessia. author. Eshghi, Kam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335898.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-5146-0
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3. 
Cover image for Theory of Digital Automata
Theory of Digital Automata
Author 
Borowik, Bohdan. author. Karpinskyy, Mykola. author. Lahno, Valery. author. Petrov, Oleksandr. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335923.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-5228-3
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4. 
Cover image for Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Author 
Wirnshofer, Martin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336184.1)
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http://dx.doi.org/10.1007/978-94-007-6196-4
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5. 
Cover image for High Mobility and Quantum Well Transistors Design and TCAD Simulation
High Mobility and Quantum Well Transistors Design and TCAD Simulation
Author 
Hellings, Geert. author. De Meyer, Kristin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336218.1)
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http://dx.doi.org/10.1007/978-94-007-6340-1
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6. 
Cover image for Photo-Excited Charge Collection Spectroscopy Probing the traps in field-effect transistors
Photo-Excited Charge Collection Spectroscopy Probing the traps in field-effect transistors
Author 
Im, Seongil. author. Chang, Youn-Gyoung. author. Kim, Jae Hoon. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336233.1)
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http://dx.doi.org/10.1007/978-94-007-6392-0
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7. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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8. 
Cover image for Introduction to Biosensors From Electric Circuits to Immunosensors
Introduction to Biosensors From Electric Circuits to Immunosensors
Author 
Yoon, Jeong-Yeol. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330812.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6022-1
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9. 
Cover image for Integrated Optical Interconnect Architectures for Embedded Systems
Integrated Optical Interconnect Architectures for Embedded Systems
Author 
O'Connor, Ian. editor. Nicolescu, Gabriela. editor. SpringerLink (Online service)
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ONLINE(330817.1)
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http://dx.doi.org/10.1007/978-1-4419-6193-8
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10. 
Cover image for Automotive Radar Sensors in Silicon Technologies
Automotive Radar Sensors in Silicon Technologies
Author 
Jain, Vipul. author. Heydari, Payam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330821.1)
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http://dx.doi.org/10.1007/978-1-4419-6775-6
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11. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
Author 
Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330846.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8795-2
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12. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
Author 
Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330847.1)
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http://dx.doi.org/10.1007/978-1-4419-8798-3
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