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1. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
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John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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2. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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3. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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4. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph.
Preferred Shelf Number 
ONLINE
Electronic Access 
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5. 
Cover image for Electronic techniques : shop practices and construction
Electronic techniques : shop practices and construction
Author 
Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.
Preferred Shelf Number 
TK7836 .V55 1996
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Beytepe Library~1
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