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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
Electronic Access 
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3. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
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4. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
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5. 
Cover image for MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applications
MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applications
Author 
Jha, A. R., author.
Preferred Shelf Number 
TK7875 .J485 2008
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6. 
Cover image for Microengineering, MEMS, and interfacing : a practical guide
Microengineering, MEMS, and interfacing : a practical guide
Author 
Banks, Danny., author.
Preferred Shelf Number 
TK7875 .B36 2006
Electronic Access 
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7. 
Cover image for MEMS and Microstructures in aerospace applications
MEMS and Microstructures in aerospace applications
Author 
Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.
Preferred Shelf Number 
TL589 .O85 2006
Electronic Access 
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