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1. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-80023-8
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2. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52548-8
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3. 
Cover image for Testing of Interposer-Based 2.5D Integrated Circuits
Testing of Interposer-Based 2.5D Integrated Circuits
Author 
Wang, Ran. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-54714-5
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4. 
Cover image for 3D Stacked Chips From Emerging Processes to Heterogeneous Systems
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Author 
Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Fettweis, Gerhard. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-20481-9
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