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1. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
Format: 
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2. 
Cover image for Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
Author 
Pecht, Michael, author. Agarwal, Rakish, author. Dishongh, Terrance J., author. Javadpour, Sirus, author. Mahajan, Rahul, author.
Preferred Shelf Number 
TK7870.15 P434 2017
Electronic Access 
Click here to view.
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3. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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4. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
Format: 
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5. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
Format: 
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6. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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7. 
Cover image for Advances in Printing, Packaging and Communication Technologies
Advances in Printing, Packaging and Communication Technologies
Author 
Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4467-4
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8. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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9. 
Cover image for Innovative Technologies for Printing, Packaging and Digital Media
Innovative Technologies for Printing, Packaging and Digital Media
Author 
Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. Yan, Shu. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-9955-2
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10. 
Cover image for Planar microwave sensors
Planar microwave sensors
Author 
Martín, Ferran, 1965- author. Vélez, Paris, author. Muñoz-Enano, Jonathan, author. Su, Lijuan, author.
Preferred Shelf Number 
TK7876 .M22 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119811060
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11. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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12. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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