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1. 
Cover image for IEEE Transactions on industrial electronics and control instrumentation.
IEEE Transactions on industrial electronics and control instrumentation.
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ALFABETİK V.17 1970
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Cover image for Power Electronics and Instrumentation Engineering International Conference, PEIE 2010, Kochi, Kerala, India, September 7-9, 2010. Proceedings
Power Electronics and Instrumentation Engineering International Conference, PEIE 2010, Kochi, Kerala, India, September 7-9, 2010. Proceedings
Author 
Das, Vinu V. editor. Stephen, Janahanlal. editor. Thankachan, Nessy. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-15739-4
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Cover image for Advances in Power Electronics and Instrumentation Engineering Second International Conference, PEIE 2011, Nagpur, Maharashtra, India, April 21-22, 2011. Proceedings
Advances in Power Electronics and Instrumentation Engineering Second International Conference, PEIE 2011, Nagpur, Maharashtra, India, April 21-22, 2011. Proceedings
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Das, Vinu V. editor. Thankachan, Nessy. editor. Debnath, Narayan C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20499-9
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Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
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Banerjee, Amal. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-08778-3
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Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
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Asadi, Farzin. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-09853-6
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Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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7. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
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Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-21610-7
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Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
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Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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9. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
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del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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10. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
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Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7636-0
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11. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
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Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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12. 
Cover image for Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
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Qin, Jiahu. author. Wan, Yanni. author. Li, Fangyuan. author. Kang, Yu. author. Fu, Weiming. author.
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https://doi.org/10.1007/978-981-19-8594-2
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