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1. 
Cover image for Sapphire structure, technology, and applications
Sapphire structure, technology, and applications
Author 
Tartaglia, Isaias, editor of compilation.
Preferred Shelf Number 
ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=548982
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2. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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3. 
Cover image for Handbook of wafer bonding
Handbook of wafer bonding
Author 
Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527644223
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735
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4. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Connect to MyiLibrary resource.
John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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5. 
Cover image for X-ray metrology in semiconductor manufacturing
X-ray metrology in semiconductor manufacturing
Author 
Bowen, D. Keith (David Keith), 1940- Tanner, B. K. (Brian Keith)
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6. 
Cover image for Semiconductor industry wafer fab exhaust management
Semiconductor industry wafer fab exhaust management
Author 
Sherer, J. Michael, 1958-
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7. 
Cover image for Interlayer dielectrics for semiconductor technologies
Interlayer dielectrics for semiconductor technologies
Author 
Murarka, S. P. Eizenberg, M. (Moshe) Sinha, A. K. (Ashok K.)
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780125112215
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8. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
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