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181. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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182. 
Cover image for Springer Handbook of Condensed Matter and Materials Data
Springer Handbook of Condensed Matter and Materials Data
Author 
Martienssen, Werner. editor. Warlimont, Hans. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-30437-1
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183. 
Cover image for An Introduction to Computational Micromechanics Corrected Second Printing
An Introduction to Computational Micromechanics Corrected Second Printing
Author 
Zohdi, Tarek I. editor. Wriggers, Peter. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-540-32360-0
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184. 
Cover image for Theory of Thermomechanical Processes in Welding
Theory of Thermomechanical Processes in Welding
Author 
Służalec, Andrzej. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/1-4020-2991-8
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185. 
Cover image for High Dielectric Constant Materials VLSI MOSFET Applications
High Dielectric Constant Materials VLSI MOSFET Applications
Author 
Huff, H.R. editor. Gilmer, D.C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137574
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186. 
Cover image for Werkstoffwissenschaften und Fertigungstechnik Eigenschaften, Vorgänge, Technologien
Werkstoffwissenschaften und Fertigungstechnik Eigenschaften, Vorgänge, Technologien
Author 
Ilschner, Bernhard. author. Singer, Robert F. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137732
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187. 
Cover image for Metallopolymer Nanocomposites
Metallopolymer Nanocomposites
Author 
Pomogailo, Anatolii D. author. Kestelman, Vladimir N. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b137740
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188. 
Cover image for Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Author 
Roos, Eberhard. author. Maile, Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138047
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189. 
Cover image for Infrared Ellipsometry on Semiconductor Layer Structures Phonons, Plasmons, and Polaritons
Infrared Ellipsometry on Semiconductor Layer Structures Phonons, Plasmons, and Polaritons
Author 
Schubert, Mathias. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b11964
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190. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b138004
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191. 
Cover image for Adhesion promotion techniques : technological applications
Adhesion promotion techniques : technological applications
Author 
Mittal, K. L., 1945- Pizzi, A. (Antonio), 1946-
Preferred Shelf Number 
TA418.7 A453 2002
Format: 
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192. 
Cover image for Nanoparticles and nanostructured surfaces : novel reporters with biological applications : 24-25 January 2001, San Jose, USA
Nanoparticles and nanostructured surfaces : novel reporters with biological applications : 24-25 January 2001, San Jose, USA
Author 
Murphy, Catherine J.
Preferred Shelf Number 
R857.O6 N36 2001
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