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13. 
Cover image for Adhesives technology for electronic applications materials, processes, reliability
Adhesives technology for electronic applications materials, processes, reliability
Author 
Licari, James J., 1930- Swanson, Dale W.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515135
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14. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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15. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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16. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
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17. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/SBEW016E
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