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1. 
Cover image for Cryptography and Embedded Systems Security
Cryptography and Embedded Systems Security
Author 
Hou, Xiaolu. author. Breier, Jakub. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62205-2
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2. 
Cover image for Dew Computing The Sustainable IoT Perspectives
Dew Computing The Sustainable IoT Perspectives
Author 
De, Debashis. editor. Roy, Samarjit. editor. (orcid)0000-0002-7874-8348 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4590-0
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3. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Author 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-40677-5
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4. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Author 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-39932-9
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5. 
Cover image for High-Performance Integrated Charge Pumps Design and Novel Solutions
High-Performance Integrated Charge Pumps Design and Novel Solutions
Author 
Ballo, Andrea. author. Grasso, Alfio Dario. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43597-3
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6. 
Cover image for Artificial Intelligence and Hardware Accelerators
Artificial Intelligence and Hardware Accelerators
Author 
Mishra, Ashutosh. editor. Cha, Jaekwang. editor. Park, Hyunbin. editor. Kim, Shiho. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22170-5
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7. 
Cover image for HEMT Technology and Applications
HEMT Technology and Applications
Author 
Lenka, Trupti Ranjan. editor. Nguyen, Hieu Pham Trung. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2165-0
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8. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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9. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
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LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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