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13. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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14. 
Cover image for Microstructure and Properties of High-Temperature Superconductors
Microstructure and Properties of High-Temperature Superconductors
Author 
Parinov, I. A. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34441-1
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15. 
Cover image for Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Author 
Seki, Shinichiro. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-4-431-54091-5
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16. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8164-6
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17. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Author 
Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0736-3
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18. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88783-8
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19. 
Cover image for Advanced Materials Science & Technology in China: A Roadmap to 2050
Advanced Materials Science & Technology in China: A Roadmap to 2050
Author 
Lu, Ke. editor. Chen, Lidong. editor. He, Tianbai. editor. Yan, Qing. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-05318-4
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20. 
Cover image for Nanoscale Magnetic Materials and Applications
Nanoscale Magnetic Materials and Applications
Author 
Liu, J. Ping. editor. Fullerton, Eric. editor. Gutfleisch, Oliver. editor. Sellmyer, D.J. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-85600-1
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21. 
Cover image for Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Author 
Zouhdi, Saïd. editor. Sihvola, Ari. editor. Vinogradov, Alexey P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9407-1
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22. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-79394-8
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23. 
Cover image for Crystal Growth of Si for Solar Cells
Crystal Growth of Si for Solar Cells
Author 
Nakajima, Kazuo. editor. Usami, Noritaka. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-02044-5
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24. 
Cover image for Low Pressure Plasmas and Microstructuring Technology
Low Pressure Plasmas and Microstructuring Technology
Author 
Franz, Gerhard. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-85849-2
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