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13. 
Cover image for Ceramic Materials Science and Engineering
Ceramic Materials Science and Engineering
Author 
Carter, C. Barry. author. Norton, M. Grant. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46271-4
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14. 
Cover image for Nanoscale microwave engineering optical control of nanodevices
Nanoscale microwave engineering optical control of nanodevices
Author 
Tripon-Canseliet, Charlotte. Chazelas, Jean.
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ONLINE(342040.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1650853
ebrary http://site.ebrary.com/id/10849225
John Wiley http://dx.doi.org/10.1002/9781118925386
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15. 
Cover image for Modern Mechanical Engineering Research, Development and Education
Modern Mechanical Engineering Research, Development and Education
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Davim, J. Paulo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-45176-8
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16. 
Cover image for Nanostructuring operations in nanoscale science and engineering
Nanostructuring operations in nanoscale science and engineering
Author 
Sharma, Kal Renganathan.
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T174.7 S515 2010
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17. 
Cover image for Micro and nanotechnologies in engineering stem cells and tissues
Micro and nanotechnologies in engineering stem cells and tissues
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Ramalingam, Murugan. Institute of Electrical and Electronics Engineers.
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Wiley Online Library
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18. 
Cover image for Micro and Nano Machining of Engineering Materials Recent Developments
Micro and Nano Machining of Engineering Materials Recent Developments
Author 
Kumar, Kaushik. editor. (orcid)0000-0002-4237-2836 Zindani, Divya. editor. (orcid)0000-0002-9941-593X Kumari, Nisha. editor. Davim, J. Paulo. editor. (orcid)0000-0002-5659-3111 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-99900-5
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19. 
Cover image for Innovation in Materials Science and Engineering Proceedings of ICEMIT 2017, Volume 2
Innovation in Materials Science and Engineering Proceedings of ICEMIT 2017, Volume 2
Author 
Chattopadhyay, Jayeeta. editor. Singh, Rahul. editor. Prakash, Om. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-2944-9
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20. 
Cover image for Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Author 
Bhattacharyya, Swapan. editor. Sen, Sabyasachi. editor. Dutta, Meghamala. editor. Biswas, Papun. editor. Chattopadhyay, Himadri. editor.
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https://doi.org/10.1007/978-981-10-3953-9
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21. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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22. 
Cover image for Glancing angle deposition of thin films : engineering the nanoscale
Glancing angle deposition of thin films : engineering the nanoscale
Author 
Hawkeye, Matthew M., author. Taschuk, Michael T., author. Brett, Michael J., author.
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ONLINE(341883.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781118847510
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23. 
Cover image for MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development
MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development
Author 
Ortloff, Dirk. author. Schmidt, Thilo. author. Hahn, Kai. author. Bieniek, Tomasz. author. Janczyk, Grzegorz. author.
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https://doi.org/10.1007/978-3-7091-0706-5
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24. 
Cover image for Surface Tension in Microsystems Engineering Below the Capillary Length
Surface Tension in Microsystems Engineering Below the Capillary Length
Author 
Lambert, Pierre. editor. SpringerLink (Online service)
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ONLINE(334451.1)
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http://dx.doi.org/10.1007/978-3-642-37552-1
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