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13. 
Cover image for Artificial Intelligence Applications and Innovations. AIAI 2023 IFIP WG 12.5 International Workshops MHDW 2023, 5G-PINE 2023, ΑΙBMG 2023, and VAA-CP-EB 2023, León, Spain, June 14-17, 2023, Proceedings
Artificial Intelligence Applications and Innovations. AIAI 2023 IFIP WG 12.5 International Workshops MHDW 2023, 5G-PINE 2023, ΑΙBMG 2023, and VAA-CP-EB 2023, León, Spain, June 14-17, 2023, Proceedings
Author 
Maglogiannis, Ilias. editor. (orcid) Iliadis, Lazaros. editor. (orcid) Papaleonidas, Antonios. editor. (orcid) Chochliouros, Ioannis. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520584.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34171-7
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14. 
Cover image for Technological Innovation for Connected Cyber Physical Spaces 14th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023, Caparica, Portugal, July 5-7, 2023, Proceedings
Technological Innovation for Connected Cyber Physical Spaces 14th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023, Caparica, Portugal, July 5-7, 2023, Proceedings
Author 
Camarinha-Matos, Luis M. editor. Ferrada, Filipa. editor. (orcid) SpringerLink (Online service)
Preferred Shelf Number 
XX(520472.1)
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https://doi.org/10.1007/978-3-031-36007-7
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15. 
Cover image for Computational Intelligence in Data Science 6th IFIP TC 12 International Conference, ICCIDS 2023, Chennai, India, February 23-25, 2023, Revised Selected Papers
Computational Intelligence in Data Science 6th IFIP TC 12 International Conference, ICCIDS 2023, Chennai, India, February 23-25, 2023, Revised Selected Papers
Author 
Chandran K R, Sarath. editor. N, Sujaudeen. editor. A, Beulah. editor. Hamead H, Shahul. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520518.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-38296-3
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16. 
Cover image for After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
Author 
Jones, Matthew R. editor. Mukherjee, Arunima S. editor. Thapa, Devinder. editor. Zheng, Yingqin. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520744.1)
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https://doi.org/10.1007/978-3-031-50154-8
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17. 
Cover image for Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies 19th IFIP WG 5.1 International Conference, PLM 2022, Grenoble, France, July 10-13, 2022, Revised Selected Papers
Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies 19th IFIP WG 5.1 International Conference, PLM 2022, Grenoble, France, July 10-13, 2022, Revised Selected Papers
Author 
Noël, Frédéric. editor. Nyffenegger, Felix. editor. (orcid) Rivest, Louis. editor. Bouras, Abdelaziz. editor. (orcid) SpringerLink (Online service)
Preferred Shelf Number 
XX(520558.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-25182-5
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18. 
Cover image for Lean, Green and Sustainability 8th IFIP WG 5.7 European Lean Educator Conference, ELEC 2022, Galway, Ireland, November 22-24, 2022, Proceedings
Lean, Green and Sustainability 8th IFIP WG 5.7 European Lean Educator Conference, ELEC 2022, Galway, Ireland, November 22-24, 2022, Proceedings
Author 
McDermott, Olivia. editor. Rosa, Angelo. editor. Sá, José Carlos. editor. Toner, Aidan. editor. SpringerLink (Online service)
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XX(520562.1)
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https://doi.org/10.1007/978-3-031-25741-4
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19. 
Cover image for Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers
Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers
Author 
Wehrmeister, Marco A. editor. Kreutz, Márcio. editor. Götz, Marcelo. editor. Henkler, Stefan. editor. Pimentel, Andy D. editor.
Preferred Shelf Number 
XX(520563.1)
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https://doi.org/10.1007/978-3-031-26500-6
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20. 
Cover image for Towards a Collaborative Society Through Creative Learning IFIP World Conference on Computers in Education, WCCE 2022, Hiroshima, Japan, August 20-24, 2022, Revised Selected Papers
Towards a Collaborative Society Through Creative Learning IFIP World Conference on Computers in Education, WCCE 2022, Hiroshima, Japan, August 20-24, 2022, Revised Selected Papers
Author 
Keane, Therese. editor. (orcid) Lewin, Cathy. editor. Brinda, Torsten. editor. Bottino, Rosa. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520643.1)
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https://doi.org/10.1007/978-3-031-43393-1
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21. 
Cover image for Advances in Digital Forensics XIX 19th IFIP WG 11.9 International Conference, ICDF 2023, Arlington, Virginia, USA, January 30-31, 2023, Revised Selected Papers
Advances in Digital Forensics XIX 19th IFIP WG 11.9 International Conference, ICDF 2023, Arlington, Virginia, USA, January 30-31, 2023, Revised Selected Papers
Author 
Peterson, Gilbert. editor. Shenoi, Sujeet. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520712.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-42991-0
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22. 
Cover image for Computer, Communication, and Signal Processing. AI, Knowledge Engineering and IoT for Smart Systems 7th IFIP TC 12 International Conference, ICCCSP 2023, Chennai, India, January 4-6, 2023, Revised Selected Papers
Computer, Communication, and Signal Processing. AI, Knowledge Engineering and IoT for Smart Systems 7th IFIP TC 12 International Conference, ICCCSP 2023, Chennai, India, January 4-6, 2023, Revised Selected Papers
Author 
Mercier-Laurent, Eunika. editor. Fernando, Xavier. editor. Chandrabose, Aravindan. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520779.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-39811-7
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23. 
Cover image for Designing Modern Embedded Systems: Software, Hardware, and Applications 7th IFIP TC 10 International Embedded Systems Symposium, IESS 2022, Lippstadt, Germany, November 3-4, 2022, Proceedings
Designing Modern Embedded Systems: Software, Hardware, and Applications 7th IFIP TC 10 International Embedded Systems Symposium, IESS 2022, Lippstadt, Germany, November 3-4, 2022, Proceedings
Author 
Henkler, Stefan. editor. Kreutz, Márcio. editor. Wehrmeister, Marco A. editor. Götz, Marcelo. editor. Rettberg, Achim. editor.
Preferred Shelf Number 
XX(520586.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34214-1
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24. 
Cover image for Human Aspects of Information Security and Assurance 17th IFIP WG 11.12 International Symposium, HAISA 2023, Kent, UK, July 4-6, 2023, Proceedings
Human Aspects of Information Security and Assurance 17th IFIP WG 11.12 International Symposium, HAISA 2023, Kent, UK, July 4-6, 2023, Proceedings
Author 
Furnell, Steven. editor. Clarke, Nathan. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520598.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-38530-8
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