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Library: Online Library

Author

SpringerLink (Online service)

(5)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Elshabini, Aicha.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961-

(1)

Lee, Ning-Cheng.

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Mantooth, H. Alan, 1963-

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Language

(22)

Publication Date

-

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Electronic packaging.

(14)

(4)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronic apparatus and appliances -- Design and construction.

(2)

Electronics -- Materials -- Permeability.

(2)

Nanotechnology.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

(1)

(1)

Dichtung (Technik)

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Reliability.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronisches Bauelement.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Extreme environments.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

Nanostructured materials.

(1)

Optoelectronic devices.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

(1)

Systems engineering.

(1)

Telecommunication.

(1)

Material Type

Shelf Location

Electronic Library

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13.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

Format:

Availability

Online Library~1

Available:
Copies:

14.

Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961-

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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Online Library~1

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15.

Cover image for Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Author

Barlow, Fred D. Elshabini, Aicha.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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16.

Cover image for Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

Format:

Availability

Online Library~1

Available:
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17.

Cover image for Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

ONLINE

Electronic Access

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18.

Cover image for Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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Availability

Online Library~1

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19.

Cover image for MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

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20.

Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author

Lee, Ning-Cheng.

Preferred Shelf Number

ONLINE

Electronic Access

Volltext http://www.sciencedirect.com/science/book/9780750672184

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21.

Cover image for Thermal design of electronic equipment

Thermal design of electronic equipment

Thermal design of electronic equipment

Author

Remsburg, Ralph.

Preferred Shelf Number

ONLINE

Electronic Access

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Availability

Online Library~1

Available:
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22.

Cover image for Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Author

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Preferred Shelf Number

ONLINE

Electronic Access

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23.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

Format:

Availability

Online Library~1

Available:
Copies:

24.

Cover image for Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Author

Pengelly, Raymond S.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/SBEW016E

Format:

Availability

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