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13. 
Cover image for MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
Author 
Guha, Koushik. editor. Dutta, Gorachand. editor. (orcid)0000-0003-2980-9826 Biswas, Arindam. editor. Srinivasa Rao, K. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8714-4
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14. 
Cover image for Microactuators, Microsensors and Micromechanisms MAMM 2022
Microactuators, Microsensors and Micromechanisms MAMM 2022
Author 
Pandey, Ashok Kumar. editor. Pal, Prem. editor. Nagahanumaiah. editor. Zentner, Lena. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-20353-4
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15. 
Cover image for Fundamentals of Nanomechanical Resonators
Fundamentals of Nanomechanical Resonators
Author 
Schmid, Silvan. author. Villanueva, Luis Guillermo. author. Roukes, Michael Lee. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29628-4
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16. 
Cover image for Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Author 
Abdullah, Muhammad Amirul. editor. Khairuddin, Ismail Mohd. editor. Ab. Nasir, Ahmad Fakhri. editor. Mohd. Isa, Wan Hasbullah. editor. Mohd. Razman, Mohd. Azraai. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8703-8
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17. 
Cover image for Fly Cutting Technology for Ultra-precision Machining
Fly Cutting Technology for Ultra-precision Machining
Author 
To, Suet. editor. Wang, Sujuan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0738-0
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18. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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19. 
Cover image for Proceedings of the 5th International Conference on Numerical Modelling in Engineering Volume 2: Numerical Modelling in Mechanical and Materials Engineering, NME 2022, 23-24 August, Ghent University, Belgium
Proceedings of the 5th International Conference on Numerical Modelling in Engineering Volume 2: Numerical Modelling in Mechanical and Materials Engineering, NME 2022, 23-24 August, Ghent University, Belgium
Author 
Abdel Wahab, Magd. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0373-3
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20. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
Author 
Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-04492-2
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21. 
Cover image for Smart sensors and MEMS : intelligent devices and microsystems for industrial applications
Smart sensors and MEMS : intelligent devices and microsystems for industrial applications
Author 
Nihtianov, Stoyan, editor. Luque, A. (Antonio), editor.
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ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020555
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22. 
Cover image for Introduction to Instrumentation and Measurements
Introduction to Instrumentation and Measurements
Author 
Northrop, Robert B., author. Taylor and Francis.
Preferred Shelf Number 
 TK7870 .N66 2015
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23. 
Cover image for Wireless MEMS networks and applications
Wireless MEMS networks and applications
Author 
Uttamchandani, Deepak, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780081004494
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24. 
Cover image for Self Assembly: The Science of Things That Put Themselves Together.
Self Assembly: The Science of Things That Put Themselves Together.
Author 
Pelesko, John A., author.
Preferred Shelf Number 
TA418.9 .N35
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/e/9781584886884
Taylor & Francis https://www.taylorfrancis.com/books/e/9780429143328
Taylor & Francis https://www.taylorfrancis.com/books/9780429143328
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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