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13. 
Cover image for Noise-Shaping All-Digital Phase-Locked Loops Modeling, Simulation, Analysis and Design
Noise-Shaping All-Digital Phase-Locked Loops Modeling, Simulation, Analysis and Design
Author 
Brandonisio, Francesco. author. Kennedy, Michael Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03659-5
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14. 
Cover image for Collective Dynamics from Bacteria to Crowds An Excursion Through Modeling, Analysis and Simulation
Collective Dynamics from Bacteria to Crowds An Excursion Through Modeling, Analysis and Simulation
Author 
Muntean, Adrian. editor. Toschi, Federico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-7091-1785-9
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15. 
Cover image for Enterprise and Organizational Modeling and Simulation 10th International Workshop, EOMAS 2014, Held at CAiSE 2014, Thessaloniki, Greece, June 16-17, 2014, Selected Papers
Enterprise and Organizational Modeling and Simulation 10th International Workshop, EOMAS 2014, Held at CAiSE 2014, Thessaloniki, Greece, June 16-17, 2014, Selected Papers
Author 
Barjis, Joseph. editor. Pergl, Robert. editor. (orcid)0000-0003-2980-4400 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44860-1
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16. 
Cover image for Elasto-Plasticity of Frame Structure Elements Modeling and Simulation of Rods and Beams
Elasto-Plasticity of Frame Structure Elements Modeling and Simulation of Rods and Beams
Author 
Öchsner, Andreas. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44225-8
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17. 
Cover image for Modeling, Simulation and Optimization for Science and Technology
Modeling, Simulation and Optimization for Science and Technology
Author 
Fitzgibbon, William. editor. Kuznetsov, Yuri A. editor. Neittaanmäki, Pekka. editor. Pironneau, Olivier. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9054-3
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18. 
Cover image for Computational Intelligence, Networked Systems and Their Applications International Conference on Life System Modeling and Simulation, LSMS 2014 and International Conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2014, Shanghai, China, September 2014, Proceedings, Part Ⅱ
Computational Intelligence, Networked Systems and Their Applications International Conference on Life System Modeling and Simulation, LSMS 2014 and International Conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2014, Shanghai, China, September 2014, Proceedings, Part Ⅱ
Author 
Fei, Minrui. editor. Peng, Chen. editor. Su, Zhou. editor. Song, Yang. editor. Han, Qinglong. editor.
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https://doi.org/10.1007/978-3-662-45261-5
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19. 
Cover image for Understanding LTE with MATLAB : from mathematical modeling to simulation and prototyping
Understanding LTE with MATLAB : from mathematical modeling to simulation and prototyping
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Zarrinkoub, Houman, author.
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ONLINE(341541.1)
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Cover image http://catalogimages.wiley.com/images/db/jimages/9781118443415.jpg
John Wiley http://dx.doi.org/10.1002/9781118443446
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20. 
Cover image for Direct Alcohol Fuel Cells Materials, Performance, Durability and Applications
Direct Alcohol Fuel Cells Materials, Performance, Durability and Applications
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Corti, Horacio R. editor. Gonzalez, Ernesto R. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-007-7708-8
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21. 
Cover image for Numerical Modeling of Materials Under Extreme Conditions
Numerical Modeling of Materials Under Extreme Conditions
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Bonora, Nicola. editor. Brown, Eric. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-54258-9
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22. 
Cover image for Practical Chemoinformatics
Practical Chemoinformatics
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Karthikeyan, Muthukumarasamy. author. Vyas, Renu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-1780-0
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23. 
Cover image for Proceedings of the 11th European Conference on Thermoelectrics ECT 2013
Proceedings of the 11th European Conference on Thermoelectrics ECT 2013
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Amaldi, Andrea. editor. Tang, Francois. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07332-3
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24. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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