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13. 
Cover image for Tactile Display for Virtual 3D Shape Rendering
Tactile Display for Virtual 3D Shape Rendering
Author 
Mansutti, Alessandro. author. Covarrubias Rodriguez, Mario. author. (orcid)0000-0003-4195-9333 Bordegoni, Monica. author. (orcid)0000-0001-9378-8295 Cugini, Umberto. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48986-5
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14. 
Cover image for Advances in Production Management Systems. The Path to Intelligent, Collaborative and Sustainable Manufacturing IFIP WG 5.7 International Conference, APMS 2017, Hamburg, Germany, September 3-7, 2017, Proceedings, Part II
Advances in Production Management Systems. The Path to Intelligent, Collaborative and Sustainable Manufacturing IFIP WG 5.7 International Conference, APMS 2017, Hamburg, Germany, September 3-7, 2017, Proceedings, Part II
Author 
Lödding, Hermann. editor. Riedel, Ralph. editor. Thoben, Klaus-Dieter. editor. von Cieminski, Gregor. editor. Kiritsis, Dimitris. editor.
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https://doi.org/10.1007/978-3-319-66926-7
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15. 
Cover image for Intelligent Computer Systems in Engineering Design Principles and Applications
Intelligent Computer Systems in Engineering Design Principles and Applications
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Sunnersjö, Staffan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28125-4
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16. 
Cover image for Power Amplifiers for the S-, C-, X- and Ku-bands An EDA Perspective
Power Amplifiers for the S-, C-, X- and Ku-bands An EDA Perspective
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Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28376-0
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17. 
Cover image for Engineering Graphics Theoretical Foundations of Engineering Geometry for Design
Engineering Graphics Theoretical Foundations of Engineering Geometry for Design
Author 
Brailov, Aleksandr Yurievich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29719-4
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18. 
Cover image for VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
Author 
Shin, Youngsoo. editor. Tsui, Chi Ying. editor. Kim, Jae-Joon. editor. Choi, Kiyoung. editor. Reis, Ricardo. editor. (orcid)0000-0001-5781-5858
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https://doi.org/10.1007/978-3-319-46097-0
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