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13. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1728-6
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14. 
Cover image for Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Author 
Osellame, Roberto. editor. Cerullo, Giulio. editor. Ramponi, Roberta. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23366-1
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15. 
Cover image for Microstructure and Properties of High-Temperature Superconductors
Microstructure and Properties of High-Temperature Superconductors
Author 
Parinov, I. A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-34441-1
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16. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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17. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Author 
Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0736-3
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18. 
Cover image for Advanced Materials Science & Technology in China: A Roadmap to 2050
Advanced Materials Science & Technology in China: A Roadmap to 2050
Author 
Lu, Ke. editor. Chen, Lidong. editor. He, Tianbai. editor. Yan, Qing. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-05318-4
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19. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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20. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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21. 
Cover image for Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Author 
Seebauer, Edmund G. author. Kratzer, Meredith C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-059-3
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22. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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23. 
Cover image for Extended Defects in Germanium Fundamental and Technological Aspects
Extended Defects in Germanium Fundamental and Technological Aspects
Author 
Claeys, Cor. editor. Simoen, Eddy. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85614-6
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24. 
Cover image for Crystal Growth of Si for Solar Cells
Crystal Growth of Si for Solar Cells
Author 
Nakajima, Kazuo. editor. Usami, Noritaka. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02044-5
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